NickelMaghrebV1, Main, Exploration, bibRecord, 000653

Interfaces in lead-free solder alloys : Enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds

Identifieur interne : 000653 ( Main/Exploration ); précédent : 000652; suivant : 000654

Interfaces in lead-free solder alloys : Enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds

Auteurs : H. Flandorfer [Autriche] ; U. Saeed [Autriche] ; C. Luef [Autriche] ; A. Sabbar [Maroc] ; H. Ipser [Autriche]

Source :

Thermochimica acta [ 0040-6031 ] ; 2007.

RBID : Pascal:07-0410025

Descripteurs français

Pascal (Inist)
- Interface, Brasage sans plomb, Alliage binaire, Energie libre formation, Composé intermétallique, Calorimétrie, Argent alliage, Etain alliage, Cuivre alliage, Nickel alliage, Propriété thermodynamique, Analyse thermique.

English descriptors

KwdEn :
- Binary alloy, Calorimetry, Copper alloy, Formation free energy, Interface, Intermetallic compound, Lead free soldering, Nickel alloy, Silver alloy, Thermal analysis, Thermodynamic properties, Tin alloy.

Abstract

Standard enthalpies of formation were determined for a number of binary intermetallic compounds in the systems Ag-Sn, Cu-Sn, and Ni-Sn by means of solution calorimetry in liquid Sn in a Calvet-type microcalorimeter. For the pure elements Ag, Cu, and Ni, the limiting partial enthalpies of mixing as well as the enthalpies of solution at infinite dilution in Sn were measured at 773, 873, 973 and 1073 K. The results for the enthalpy of formation for the intermetallic compounds Ag₃Sn, Ag₄Sn, Cu₃Sn, Cu₄₁Sn₁₁, Cu₆Sn₅, Ni₃Sn-LT, Ni₃Sn₂-HT, and Ni₃Sn₄ are discussed and compared with the corresponding literature values.

Affiliations:

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Le document en format XML

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<term>Lead free soldering</term>
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<term>Calorimétrie</term>
<term>Argent alliage</term>
<term>Etain alliage</term>
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<front><div type="abstract" xml:lang="en">Standard enthalpies of formation were determined for a number of binary intermetallic compounds in the systems Ag-Sn, Cu-Sn, and Ni-Sn by means of solution calorimetry in liquid Sn in a Calvet-type microcalorimeter. For the pure elements Ag, Cu, and Ni, the limiting partial enthalpies of mixing as well as the enthalpies of solution at infinite dilution in Sn were measured at 773, 873, 973 and 1073 K. The results for the enthalpy of formation for the intermetallic compounds Ag<sub>3</sub>
Sn, Ag<sub>4</sub>
Sn, Cu<sub>3</sub>
Sn, Cu<sub>41</sub>
Sn<sub>11</sub>
, Cu<sub>6</sub>
Sn<sub>5</sub>
, Ni<sub>3</sub>
Sn-LT, Ni<sub>3</sub>
Sn<sub>2</sub>
-HT, and Ni<sub>3</sub>
Sn<sub>4</sub>
 are discussed and compared with the corresponding literature values.</div>
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Interfaces in lead-free solder alloys : Enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds

Interfaces in lead-free solder alloys : Enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds

Source :

Descripteurs français

English descriptors

Abstract

Links toward previous steps (curation, corpus...)

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Pour manipuler ce document sous Unix (Dilib)

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